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US 2022/0069795 A1Published application
Metal ribs in electromechanical devices
AssigneeTexas Instruments Incorporated
InventorsAnindya PODDAR, Hau NGUYEN, Masamitsu MATSUURA
Life of this patent
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Abstract
In examples, a device comprises a semiconductor die, a thin-film layer, and an air cavity positioned between the semiconductor die and the thin-film layer. The air cavity comprises a resonator positioned on the semiconductor die. A rib couples to a surface of the thin-film layer opposite the air cavity.
Claims27
A device, comprising:
- a semiconductor die;
- a thin-film layer;
- an air cavity positioned between the semiconductor die and the thin-film layer, the air cavity comprising a resonator positioned on the semiconductor die;
- and
- a rib coupled to a surface of the thin-film layer opposite the air cavity.
2 more elements
A device, comprising:
- a semiconductor die;
- an insulative layer;
- an air cavity positioned between the semiconductor die and the insulative layer, the air cavity comprising a trench formed in the semiconductor die and partially circumscribing a platform formed in the semiconductor die;
- a resonator positioned on the platform and in the air cavity;
- and
- a rib positioned on the insulative layer such that the air cavity is between the rib and the platform.
3 more elements
A package, comprising:
- a first semiconductor die having a first active surface;
- an insulative layer;
- an air cavity positioned between the first semiconductor die and the insulative layer, the air cavity comprising:
- a trench formed in the first semiconductor die, the trench partially circumscribing a platform formed in the first semiconductor die;
- and
- a resonator positioned on the platform;
- a first conductive terminal coupled to the first active surface and extending through the insulative layer;
- a rib positioned on the insulative layer such that the insulative layer is between the rib and the air cavity;
- a second semiconductor die having a second active surface;
- a second conductive terminal coupled to the second active surface and to the first conductive terminal;
- and
- a mold compound covering the rib and the insulative layer.
9 more elements
Dependencies are inferred from the claim text.