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US 2022/0069540 A1Published application
Header for an electronic or opto-electronic component and process for manufacturing of such
AssigneeSchott AG
InventorsOng Wai Li, Jian Dean Tan, Amy Soon Li Ping, Andreas Krause, Artit Aowudomsuk, Karsten Droegemueller
Life of this patent
Estimating the term…
Abstract
A header for an electronic component is provided. The header includes a base, a pedestal, and a submount. The base has a feedthrough with a feedthrough pin extending through the base and being electrically insulated from the base. The pedestal is connected to the base. The submount is connected to the pedestal. The pedestal is joined to the base via a pedestal substance-to-substance bond.
Claims19
A header for an electronic component, comprising:
- a base;
- a feedthrough having a feedthrough pin extending through the base and being electrically insulated from the base;
- a pedestal connected to the base via a pedestal substance-to-substance bond;
- and
- a submount connected to the pedestal.
2 more elements
A method for producing a header for an electronic component, comprising:
- forming a base with an opening, the base does not have pedestals for accommodating a submount;
- introducing a pin into the opening and sealing the opening with an insulating material so that the pin is fixed in the opening and is electrically insulated from the base so as to define a feedthrough;
- providing a pedestal and a submount;
- bonding the pedestal to the base with a pedestal substance-to-substance bond;
- and
- bonding the submount to the pedestal with a submount substance-to-substance bond.
3 more elements
Dependencies are inferred from the claim text.