Antenna-in-Package Transceiver Module

An apparatus comprising:

• a printed circuit board (PCB) that includes a first set of pads disposed on a first layer of the PCB and a conductive area disposed between at least two pads of the first set of pads;
• solder balls coupled to the first set of pads, each of the solder balls coupled to a respective one of the first set of pads disposed on the first layer of the PCB;
• and
• an antenna-in-package (AiP) transceiver module coupled to the PCB by the solder balls, the AiP transceiver module comprising:
• a substrate of dielectric material;
• a transceiver integrated circuit (IC) disposed on a first surface of the substrate;
• an antenna element disposed on the first surface of the substrate and coupled to the transceiver IC die;
• a second set of pads disposed on a second surface of the substrate, each of the solder balls coupled to a respective one of the second set of pads disposed on the second surface of the substrate;
• and
• a dielectric interface area of the second surface of the substrate disposed between at least two pads of the second set of pads, the dielectric interface area being opposite an area on the first surface of the substrate in which the antenna element is disposed.