Method for manufacturing an antenna printed circuit board

A method for manufacturing an antenna printed circuit board comprising:

• providing a flexible-rigid printed circuit board comprising a flexible region and a rigid region, wherein the rigid region comprises at least one exposed first connecting pad and at least one exposed second connecting pad, the at least one first connecting pad and the at least one second connecting pad are arranged opposite sides of the rigid region;
• forming a conductive paste on the at least one first connecting pad, and attaching at least one antenna module to the conductive paste on the at least one first connecting pad to electrically connect the at least one antenna module and the at least one first connecting pad;
• fixing the at least one antenna module on the rigid region of the flexible-rigid printed circuit board by a first reflow soldering process;
• forming a conductive paste on the at least one second connecting pad, and attaching at least one radio frequency integrated circuit structure to the conductive paste on the at least one second connecting pad to electrically connect the at least one radio frequency integrated circuit structure and the rigid region of the flexible-rigid printed circuit board;
• fixing the at least one radio frequency integrated circuit structure on the rigid region of the flexible-rigid printed circuit board by a second reflow soldering process;
• and
• filling dielectric materials in a gap between the at least one antenna module and the rigid region of the flexible-rigid printed circuit board and a gap between the radio frequency integrated circuit structure and the rigid region of the flexible-rigid printed circuit board, and curing the dielectric materials to form two dielectric layers.