Resistive random access memory and method of manufacturing the same
AssigneeWinbond Electronics Corp.
InventorsPo-Yen HSU, Bo-Lun WU, Tse-Mian KUO
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AssigneeWinbond Electronics Corp.
InventorsPo-Yen HSU, Bo-Lun WU, Tse-Mian KUO
Estimating the term…
A resistive random access memory is provided. The resistive random access memory includes a substrate, a first dielectric layer, a bottom electrode, a resistance switching layer, an oxygen exchange layer, a barrier layer and a top electrode. The first dielectric layer is disposed on the substrate. The bottom electrode is disposed on the first dielectric layer. The resistance switching layer is disposed on the bottom electrode. The oxygen exchange layer is disposed on the resistance switching layer. A contact area between the oxygen exchange layer and the resistance switching layer is smaller than a top surface area of the resistance switching layer. The barrier layer is disposed on the oxygen exchange layer. The top electrode is disposed on the barrier layer.
A resistive random access memory, comprising:
A method for manufacturing a resistive random access memory, comprising:
Dependencies are inferred from the claim text.