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US 2022/0069203 A1Published application
Semiconductor die with sensor section located at the edge
AssigneeInfineon Technologies AG
InventorsMomtchil STAVREV, Dirk MEINHOLD
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Abstract
A semiconductor die is proposed, wherein the semiconductor die comprises a microelectronic section and a sensor section. The microelectronic section comprises an integrated circuit. The sensor section adjoins an edge of the semiconductor die. A sensor is also proposed, which comprises such a semiconductor die.
Claims18
A semiconductor die comprising:
- a microelectronic section,
- wherein the microelectronic section comprises an integrated circuit;
- and
- a sensor section,
- wherein the sensor section adjoins an edge of the semiconductor.
2 more elements
A sensor comprising:
- a semiconductor die comprising:
- a microelectronic section that comprises an integrated circuit and
- a sensor section, wherein the sensor section adjoins an edge of the semiconductor die;
- a housing, wherein the housing comprises:
- a mounting surface,
- a contact terminal, and
- a housing contacting surface electrically conductively connected to the contact terminal;
- and
- a bonding wire,
- wherein bonding wire electrically conductively connects a die-contacting surface to the housing contacting surface,
- wherein the die-contacting surface is located on a side of the microelectronic section facing away from the sensor section, and
- wherein the semiconductor die is mechanically connected to the mounting surface.
9 more elements
Dependencies are inferred from the claim text.