Electronic component joining method and joined structure
AssigneeKYOCERA Corporation
InventorsKentaro MURAKAWA, Katsuaki MASAKI
Life of this patent
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Abstract
The present disclosure relates to an electronic component joining method and a joined structure. A solder layer made of a gold-tin alloy including 20 mass % or greater of tin is formed on a light-emitting element side, and a layer including gold as a main component is formed, as a joining layer for joining to the solder layer, on a submount side. The solder layer and the joining layer are heated at a temperature below the melting point of the gold-tin alloy of the solder layer to join the light-emitting element and the submount.
Claims18
An electronic component joining method of joining a side of an electronic component comprising an electrode and a side of a mount target object comprising a mounting surface on which the electronic component is to be mounted, the electronic component joining method comprising:
- a layer forming step of forming a solder layer made of a gold-tin alloy comprising 20 mass % or greater of tin on the electrode of the electronic component, and forming a joining layer comprising gold as a main component on the mounting surface of the mount target object;
- and
- a joining step of heating the solder layer and the joining layer at a temperature lower than a melting point of the gold-tin alloy, and joining the solder layer and the joining layer.
A joined structure having an electronic component comprising an electrode, and a mount target object comprising a mounting surface on which the electronic component is to be mounted, the joined structure comprising:
- a solder layer made of a gold-tin alloy comprising 20 mass % or greater of tin, the solder layer located on the electrode of the electronic component;
- a joining layer comprising gold as a main component, the joining layer located on the mounting surface of the mount target object;
- and
- an intermediate layer made of a gold-tin alloy with a lower melting point than a melting point of the solder layer, the intermediate layer being located between the solder layer and the joining layer.
Dependencies are inferred from the claim text.