Integrating structure for crystal resonator and control circuit, and integrating method therefor
AssigneeNingbo Semiconductor International Corporation (Shanghai Branch)
InventorXiaoshan QIN
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Abstract
A structure and method for integrating a crystal resonator with a control circuit are disclosed. The crystal resonator is integrated with both the control circuit (110) and a semiconductor die (900) on a single device wafer (100) through forming a piezoelectric vibrator (500) on, and bonding the semiconductor die (900) to, a back side of the device wafer (100). This allows an increased degree of integration of the crystal resonator and on-chip modulation of its parameters. Compared with traditional crystal resonators, the disclosed crystal resonator is more compact in size and hence less power-consuming.
Claims32
A method for integrating a crystal resonator with a control circuit, comprising:
- providing a device wafer having the control circuit formed therein;
- forming a lower cavity in the device wafer, the lower cavity having an opening formed at a back side of the device wafer;
- forming a piezoelectric vibrator comprising a top electrode, a piezoelectric crystal and a bottom electrode on the back side of the device wafer, the piezoelectric vibrator arranged in alignment with the lower cavity, and forming a first connecting structure electrically connecting the top and bottom electrodes of the piezoelectric vibrator to the control circuit;
- forming a cap layer over the back side of the device wafer, which hoods the piezoelectric vibrator and delimits an upper cavity of the crystal resonator together with the piezoelectric vibrator and the device wafer;
- and
- bonding a semiconductor die to the back side of the device wafer and forming a second connecting structure electrically connecting the semiconductor die to the control circuit.
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A structure for integrating a crystal resonator with a control circuit, comprising:
- a device wafer in which the control circuit and a lower cavity are formed, the lower cavity having an opening at a back side of the device wafer;
- a piezoelectric vibrator comprising a bottom electrode, a piezoelectric crystal and a top electrode, the piezoelectric vibrator formed on the back side of the device wafer in alignment with the lower cavity;
- a first connecting structure formed on the device wafer, the first connecting structure electrically connecting the top and bottom electrodes of the piezoelectric vibrator to the control circuit;
- a cap layer formed on the back side of the device wafer, the cap layer hooding the piezoelectric vibrator, the cap layer delimiting an upper cavity together with the piezoelectric vibrator and the device wafer;
- a semiconductor die bonded to the back side of the device wafer;
- and
- a second connecting structure electrically connecting the semiconductor die to the control circuit.
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Dependencies are inferred from the claim text.