Backside illuminated image sensor and method of manufacturing the same
AssigneeDB HiTek Co., Ltd.
InventorChang Hun HAN
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Abstract
A backside illuminated image sensor and a method of manufacturing the same are disclosed. The backside illuminated image sensor includes a substrate having a frontside surface, a backside surface and a recess formed in a backside surface portion thereof, pixel regions disposed in the substrate, an insulating layer disposed on the frontside surface of the substrate, a bonding pad disposed on a frontside surface of the insulating layer, a second bonding pad formed with a constant thickness on a bottom surface and an inner side surface of the recess to form a second recess in the recess and electrically connected with the bonding pad, and a third bonding pad formed in the second recess to fill the second recess.
Claims20
A backside illuminated image sensor comprising:
- a substrate having a frontside surface and a backside surface, and the substrate defining a recess formed in a backside surface portion thereof;
- at least one pixel region disposed in the substrate;
- an insulating layer disposed on the frontside surface of the substrate;
- a bonding pad disposed on a frontside surface of the insulating layer;
- a second bonding pad having a constant thickness on a bottom surface, the second bonding pad further defining an inner side surface of the recess to form a second recess within the recess, the second bonding pad electrically connected with the bonding pad;
- and
- a third bonding pad formed in the second recess and arranged to fill the second recess.
A method of manufacturing a backside illuminated image sensor, the method comprising:
- forming pixel regions in a substrate;
- forming an insulating layer on a frontside surface of the substrate;
- forming a bonding pad on a frontside surface of the insulating layer;
- partially removing a backside surface portion of the substrate to form a recess;
- forming a second bonding pad to be electrically connected with the bonding pad, the second bonding pad having a constant thickness and being formed on a bottom surface and an inner side surface of the recess to define a second recess in the recess;
- and
- forming a third bonding pad in the second recess and arranged to fill the second recess.
Dependencies are inferred from the claim text.