Die to die interface circuit
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTze-Chiang Huang, King-Ho Tam, Yu-Hao Liu
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Abstract
Disclosed herein are related to an integrated circuit including multiple dies stacked along a direction. In one aspect, the integrated circuit includes a first die, a second die, and a third die stacked along the direction. In one aspect, the first die includes a first interface circuit to generate a signal. In one aspect, the second die includes a second interface circuit to receive the signal from the first interface circuit and generate a replicate signal of the signal. In one aspect, the third die includes a third interface circuit to receive the replicate signal from the second interface circuit.
Claims20
An integrated circuit comprising:
- a first die;
- and
- a second die disposed above the first die along a direction, the second die including:
- a first layer,
- a second layer disposed above the first layer along the direction,
- a first metal rail extending through the first layer along the direction to electrically couple to the first die,
- a second metal rail extending through the second layer along the direction, and
- a first interface circuit disposed in the second layer, the first interface circuit to propagate a signal between the first metal rail and the second metal rail, while electrically separating between an electrical load of the first metal rail and an electrical load of the second metal rail.
An integrated circuit comprising:
- a first die including a first interface circuit, the first interface circuit to generate a signal;
- a second die disposed above the first die along a direction, the second die including a second interface circuit to receive the signal from the first interface circuit and generate a replicate signal of the signal;
- and
- a third die disposed above the second die along the direction, the third die including a third interface circuit to receive the replicate signal from the second interface circuit.
A method comprising:
- forming a first layer of a first die;
- forming a first metal rail extending through the first layer along a direction;
- forming a second layer of the first die along the direction;
- forming a second metal rail extending through the second layer along the direction;
- forming a first interface circuit in the second layer, wherein the first interface circuit is configured to propagate a signal between the first metal rail and the second metal rail, while electrically separating between an electrical load of the first metal rail and an electrical load of the second metal rail;
- forming a third layer of a second die above the first die along the direction;
- forming a third metal rail extending through the third layer along the direction;
- forming a fourth layer of the second die along the direction;
- and
- forming a second interface circuit in the fourth layer, wherein the second interface circuit is configured to receive the signal from the first interface circuit through the third metal rail.
Dependencies are inferred from the claim text.