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US 2022/0068879 A1Published application
Semiconductor device
OwnerYuichi SANOinventor
Life of this patent
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Abstract
According to one embodiment, a semiconductor device includes a substrate with a first terminal, a first semiconductor memory chip on the substrate and having a first pad, and a second semiconductor memory chip on the first semiconductor memory chip and having a second pad. A first bonding wire connects to the first terminal and both the first pad and the second pad. A second bonding wire connects to the first terminal and one of the first pad or the second pad from a coordinate position offset from a coordinate position of the first bonding wire.
Claims20
A semiconductor device, comprising:
- a substrate having a first terminal;
- a first semiconductor memory chip on the substrate and having a first pad;
- a second semiconductor memory chip on the first semiconductor memory chip and having a second pad;
- a first bonding wire that connects to the first terminal and both the first pad and the second pad;
- and
- a second bonding wire that connects to the first terminal and one of the first pad or the second pad from a coordinate position offset from a coordinate position of the first bonding wire.
3 more elements
A semiconductor device, comprising:
- a wiring substrate having a plurality of terminals including a first terminal, a second terminal, and a third terminal aligned in a row, the third terminal being between the first and second terminals in the row and adjacent to at least one of the first and second terminals;
- a first chip mounted on the wiring substrate and having a plurality of pads on an upper surface thereof, the plurality of pads including a first pad, a second pad, and a third pad aligned in row, the third pad being between the first and second pads in the row and adjacent to at least one of the first and second pads;
- a second chip stacked on the upper surface of first chip and having a plurality of pads on an upper surface thereof, the plurality of pads including a fourth pad, a fifth pad, and a sixth pad aligned in row, the sixth pad being between the fourth and fifth pads in the row and adjacent to at least one of the fourth and fifth pads;
- a first bonding wire connecting to the first terminal, the first pad, and the fourth pad;
- a second bonding wire connecting to the second terminal, the second pad, and the fifth pad;
- a third bonding wire connecting to the third terminal, the third pad, and the sixth pad;
- and
- a fourth bonding wire connecting to the second terminal and one of the second pad or the fifth pad but not both from a coordinate position offset along a direction of the row from a coordinate position of the second bonding wire.
5 more elements
Dependencies are inferred from the claim text.