Method of manufacturing a semiconductor package and apparatus for performing the same

A method of manufacturing a semiconductor package, the method comprising:

• obtaining first warpage information with respect to a warpage of a reference package substrate in a curing process of applying heat to the reference package substrate to cure a first die attach film thereon, wherein the reference package substrate has a first plurality of semiconductor chips attached to the reference package substrate using the first die attach film;
• rotating a package substrate, which includes a first surface and a second surface opposite to the first surface, at an angle selected based on the first warpage information, wherein the package substrate has a second plurality of semiconductor chips attached to the package substrate using a second die attach film, the second plurality of semiconductor chips and the second die attach film being on the first surface of the package substrate;
• and
• applying the heat to the package substrate to cure the second die attach film while correcting for a warpage of the package substrate.

An apparatus for manufacturing a semiconductor package, the apparatus comprising:

• a controller configured to store first warpage information with respect to a warpage of a reference package substrate in a process of applying heat to the reference package substrate to curing a first die attach film thereon, wherein the reference package substrate has a first plurality of semiconductor chips attached to the reference package substrate using the first die attach film;
• a curing chamber configured to apply heat to a package substrate, which includes a first surface and a second surface opposite to the first surface, wherein the package substrate has a second plurality of semiconductor chips attached to the package substrate using a second die attach film, the second plurality of semiconductor chips and the second die attach film being on the first surface of the package substrate, the second die attach film being cured in the curing chamber;
• and
• an actuator configured to rotate the package substrate at an angle selected based on the first warpage information.