Laser bonding system and laser bonding apparatus

A laser bonding system comprising:

• a laser bonding apparatus including,
• a stage configured to support a substrate and a semiconductor chip,
• a pressurizer above the stage,
• an elevator configured to raise and lower the pressurizer, and
• a laser radiation apparatus configured to emit a laser beam through the pressurizer to bond a pad of the substrate and a connection terminal of the semiconductor chip;
• and
• a controller configured to control the laser bonding apparatus to lower the elevator so that the semiconductor chip is pressed by a lower face of the pressurizer, and lift the elevator so that the lower face of the pressurizer is spaced apart from semiconductor chip.

A laser bonding apparatus comprising:

• a stage configured to support a substrate and a semiconductor chip;
• a transmission on the stage;
• a support surrounding side walls of the transmission to support the transmission;
• an elevator configured to raise and lower the support to selectively press a lower face of the transmission into an upper face of the semiconductor chip;
• first to fourth pressure providers spaced apart from each other on the support to connect the support and the elevator, the first to fourth pressure providers each configured to provide a same pressure to the support;
• and
• a laser radiation apparatus configured to emit a laser beam through the transmission to bond a pad of the substrate and a connection terminal of the semiconductor chip.