Semiconductor package, redistribution structure and method for forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChiang-Hao Lee, Hung-Jui Kuo, Ming-Che Ho
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Abstract
A semiconductor package, a redistribution structure and a method for forming the same are provided. The redistribution structure for coupling an encapsulated die is provided, the redistribution structure includes a conductive pattern disposed over and electrically coupled to the encapsulated die. The conductive pattern extends beyond an edge of the encapsulated die along a first extending direction which intersects a second extending direction of the edge of the encapsulated die by an angle in a top view, and an impurity concentration of sulfur in the conductive pattern is less than about 0.1 ppm.
Claims20
A redistribution structure for coupling an encapsulated die, the redistribution structure comprising:
- a conductive pattern disposed over and electrically coupled to the encapsulated die, wherein the conductive pattern extends beyond an edge of the encapsulated die along a first extending direction which intersects a second extending direction of the edge of the encapsulated die by an angle in a top view, and an impurity concentration of sulfur in the conductive pattern is less than about 0.1 ppm.
A semiconductor package, comprising:
- a semiconductor die encapsulated by an insulating encapsulation;
- a through insulating via disposed aside the semiconductor die and penetrating through the insulating encapsulation;
- and
- a redistribution circuitry coupling the semiconductor die to the through insulating via, the redistribution circuitry comprising an average grain size greater than an average grain size of the through insulating via for a given thickness.
An electroplating method, comprising:
- immersing a work piece into a plating solution in a plating tank, wherein the plating solution is free of organic additive agents;
- performing an electrochemical reaction on the plating solution to form a redistribution circuitry on the work piece;
- and
- filtering the plating solution via a carbon filter before returning to the plating tank.
Dependencies are inferred from the claim text.