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US 2022/0068868 A1Published application
Semiconductor package and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsAn-Nong WEN, Ching-Han HUANG, Ching-Ho CHANG
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Abstract
A semiconductor package includes a first die having a first surface, a first conductive bump over the first surface and having first height and a first width, a second conductive bump over the first surface and having a second height and a second width. The first width is greater than the second width and the first height is substantially identical to the second height. A method for manufacturing the semiconductor package is also provided.
Claims20
A semiconductor package, comprising:
- a first electronic component having a first pad and a second pad;
- a second electronic component joined with the first electronic component;
- a first conductive bump on the first pad;
- a first solder bump on the first conductive bump;
- a second conductive bump on the second pad;
- and
- a second solder bump on the second pad, wherein the second solder bump is not bonded to the second electronic component.
4 more elements
A semiconductor package, comprising:
- an electronic substrate;
- a micro electro mechanical system (MEMS) component adjacent to a first side of the electronic substrate and joined with the electronic substrate;
- a first conductive bump at the first side of the electronic substrate;
- a second conductive bump at the first side of the electronic substrate;
- a first solder bump on the first conductive bump, wherein the first solder bump is configured to bond the electronic substrate and the MEMS component;
- a second solder bump on the second conductive bump;
- and
- a carrier joined with the electronic substrate through a conductive terminal.
5 more elements
A semiconductor package, comprising:
- a first electronic component having a first surface;
- a second electronic component having a second surface facing the first surface;
- a first conductive bump over the first surface and configured to bond the first electronic component and the second electronic component;
- and
- a second conductive bump over the first surface and physically separated from the second electronic component.
2 more elements
Dependencies are inferred from the claim text.