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US 2022/0068864 A1Published application
Integrated circuit, package structure, and manufacturing method of package structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHung-Jui Kuo, Hui-Jung Tsai, Tai-Min Chang, Chia-Wei Wang
Life of this patent
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Abstract
An integrated circuit includes a semiconductor substrate, contact pads, testing pads, conductive posts, and dummy posts. The contact pads and the testing pads are distributed over the semiconductor substrate. The conductive posts are disposed on the contact pads. The dummy posts are disposed on the testing pads. A height of the conductive posts is greater than a height of the dummy posts.
Claims20
An integrated circuit, comprising:
- a semiconductor substrate;
- contact pads and testing pads distributed over the semiconductor substrate;
- conductive posts disposed on the contact pads;
- and
- dummy posts disposed on the testing pads, wherein a height of the conductive posts is greater than a height of the dummy posts.
2 more elements
A package structure, comprising:
- an integrated circuit, comprising:
- a semiconductor substrate;
- contact pads and testing pads distributed over the semiconductor substrate;
- conductive posts disposed on the contact pads;
- and
- dummy posts disposed on the testing pads, wherein the dummy posts are electrically floating;
- an encapsulant laterally encapsulating the integrated circuit;
- and
- a redistribution structure disposed on the integrated circuit and the encapsulant, wherein the conductive posts are electrically connected to the redistribution structure.
6 more elements
A manufacturing method of a package structure, comprising:
- forming an integrated circuit, comprising:
- providing a semiconductor wafer;
- forming contact pads and testing pads over the semiconductor wafer;
- forming a passivation layer over the contact pads and the testing pads, wherein the passivation layer partially exposes each contact pad and each testing pad;
- forming conductive posts on the contact pads;
- and
- forming dummy posts on the testing pads, wherein the dummy posts are formed to be shorter than the conductive posts;
- encapsulating the integrated circuit by an encapsulant;
- and
- forming a redistribution structure over the integrated circuit and the encapsulant.
7 more elements
Dependencies are inferred from the claim text.