Semiconductor device structure with conductive polymer liner and method for forming the same
AssigneeNanya Technology Corporation
InventorYu-Han HSUEH
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Abstract
The present disclosure relates to a semiconductor device structure with a conductive polymer liner and a method for preparing the semiconductor device structure. The semiconductor device structure includes a first metal layer disposed over a semiconductor substrate, and a second metal layer disposed over the first metal layer. The semiconductor device structure also includes a conductive structure disposed between the first metal layer and the second metal layer. The conductive structure includes a first conductive via and a first conductive polymer liner surrounding the first conductive via.
Claims20
A semiconductor device structure, comprising:
- a first metal layer disposed over a semiconductor substrate;
- a second metal layer disposed over the first metal layer;
- and
- a conductive structure disposed between the first metal layer and the second metal layer, wherein the conductive structure comprises a first conductive via and a first conductive polymer liner surrounding the first conductive via.
A semiconductor device structure, comprising:
- a first metal layer disposed over a semiconductor substrate;
- a conductive structure disposed over the first metal layer, wherein the conductive structure comprises a first conductive via, a second conductive via disposed over the first conductive via, a first conductive polymer liner disposed on sidewalls of the first conductive via, and a second conductive polymer liner disposed on sidewalls of the second conductive via, and wherein the first conductive polymer liner and the second conductive polymer liner comprise graphene or conjugated polymer;
- and
- a second metal layer disposed over the conductive structure.
A method for forming a semiconductor device structure, comprising:
- forming a first semiconductor die, wherein the first semiconductor die comprises a first metal layer, a first conductive via over the first metal layer, and a first conductive polymer liner surrounding the first conductive via;
- forming a second semiconductor die, wherein the second semiconductor die comprises a second metal layer, a second conductive via over the second metal layer, and a second conductive polymer liner surrounding the second conductive via;
- and
- forming a conductive structure electrically connecting the first metal layer and the second metal layer by bonding the second semiconductor die to the first semiconductor die, wherein the conductive structure is formed by the first conductive via, the first conductive polymer liner, the second conductive via, and the second conductive polymer liner, the first conductive via is bonded with the second conductive via, and the first conductive polymer liner is bonded with the second conductive polymer liner.
Dependencies are inferred from the claim text.