Surface finish structure of multi-layer substrate and method for manufacturing the same
AssigneePrinco Corp.
InventorPei-Liang CHIU
Life of this patent
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Abstract
A surface finish structure of a multi-layer substrate includes: a dielectric layer; at least one pad layer formed on the dielectric layer or embedded in the dielectric layer; at least one protective metal layer formed on the at least one pad layer and contacting the pad layer, wherein the at least one protective metal layer only covers a top surface of the at least one pad layer, and the at least one protective metal layer is configured to be soldered to or contact an external element; and a solder mask layer formed on the dielectric layer and including at least one opening to expose the at least one protective metal layer. A method for manufacturing a surface finish structure of a multi-layer substrate is also provided.
Claims23
A surface finish structure of a multi-layer substrate, comprising:
- a dielectric layer;
- at least one pad layer formed on the dielectric layer;
- at least one protective metal layer formed on the at least one pad layer and contacting the at least one pad layer, wherein the at least one protective metal layer only covers a top surface of the at least one pad layer, and the at least one protective metal layer is configured to be soldered to or contact an external element;
- and
- a solder mask layer formed on the dielectric layer and comprising at least one opening to expose the at least one protective metal layer.
A surface finish structure of a multi-layer substrate, comprising:
- a dielectric layer;
- at least one pad layer embedded in the dielectric layer;
- and
- at least one protective metal layer formed on the at least one pad layer and contacting the at least one pad layer, wherein the at least one protective metal layer only covers a top surface of the at least one pad layer, the at least one protective metal layer is configured to be soldered to or contact an external element, and the at least one protective metal layer is also embedded in the dielectric layer.
A method for manufacturing a surface finish structure of a multi-layer substrate, comprising:
- providing a dielectric layer;
- forming at least one pad layer on the dielectric layer;
- forming at least one protective metal layer on the at least one pad layer, wherein the at least one protective metal layer only covers a top surface of the at least one pad layer, and the at least one protective metal layer is configured to be soldered to or contact an external element;
- and
- forming a solder mask layer on the dielectric layer, wherein the solder mask layer comprises at least one opening to expose the at least one protective metal layer.
A method for manufacturing a surface finish structure of a multi-layer substrate, comprising:
- providing a dielectric layer;
- forming at least one groove in the dielectric layer;
- forming at least one pad layer in the at least one groove, wherein the at least one pad layer is embedded in the dielectric layer;
- and
- forming at least one protective metal layer on the at least one pad layer, wherein the at least one protective metal layer only covers a top surface of the at least one pad layer, the at least one protective metal layer is configured to be soldered to or contact an external element, and the at least one protective metal layer is also embedded in the dielectric layer.
A method for manufacturing a surface finish structure of a multi-layer substrate, comprising:
- providing a substrate;
- forming a photosensitive dielectric layer on the substrate;
- patterning the photosensitive dielectric layer to form at least one groove in the photosensitive dielectric layer;
- forming at least one pad layer in the at least one groove;
- and
- forming at least one protective metal layer on the at least one pad layer, wherein the at least one protective metal layer only covers a top surface of the at least one pad layer, and the at least one protective metal layer is configured to be soldered to or contact an external element.
Dependencies are inferred from the claim text.