Semiconductor device having three-dimensional structure
AssigneeSK hynix Inc.
InventorsSung Lae OH, Sang Woo PARK
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Abstract
A semiconductor device having a three-dimensional structure includes a first wafer including a first bonding pad on one surface thereof; a second wafer including a second bonding pad, which is bonded to the first bonding pad, on one surface thereof bonded to the one surface of the first wafer; a plurality of anti-warpage grooves on the one surface of the first wafer, and laid out in a stripe shape; and a plurality of anti-warpage ribs on the one surface of the second wafer and coupled respectively to the plurality of anti-warpage grooves, and laid out in a stripe shape.
Claims20
A semiconductor device having a three-dimensional structure, comprising:
- a first wafer including a first bonding pad on one surface thereof;
- a second wafer including a second bonding pad, which is bonded to the first bonding pad, on one surface thereof bonded to the one surface of the first wafer;
- a plurality of anti-warpage grooves on the one surface of the first wafer, and laid out in a stripe shape;
- and
- a plurality of anti-warpage ribs on the one surface of the second wafer and coupled respectively to the plurality of anti-warpage grooves, and laid out in a stripe shape.
A semiconductor device having a three-dimensional structure, comprising:
- a first wafer including a first bonding pad on one surface thereof;
- a second wafer including a second bonding pad, which is bonded to the first bonding pad, on one surface thereof bonded to the one surface of the first wafer;
- a plurality of first anti-warpage pads on the one surface of the first wafer, and laid out in a stripe shape;
- and
- a plurality of second anti-warpage pads on the one surface of the second wafer and bonded respectively to the plurality of first anti-warpage pads, and laid out in a stripe shape.
A semiconductor device having a three-dimensional structure, comprising:
- a first wafer including a first bonding pad on one surface thereof;
- a second wafer including a second bonding pad, which is bonded to the first bonding pad, on one surface thereof bonded to the one surface of the first wafer;
- and
- a plurality of anti-warpage metal ribs defined in the first wafer, and laid out in a stripe shape.
Dependencies are inferred from the claim text.