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US 2022/0068841 A1Published application
Stacked semiconductor package with stepped stiffener
AssigneeIntel Corporation
InventorsJenny Shio Yin ONG, Seok Ling LIM, Bok Eng CHEAH, Jackson Chung Peng KONG
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Abstract
According to various examples, a device is described. The device may include a stiffener member including a first step section and a second step section. The device may also include a plurality of vias extending from or through the stiffener member. The device may be coupled to a printed circuit board.
Claims20
A device comprising:
- a stiffener member comprising a first step section and a second step section;
- and
- a plurality of vias extending from or through the stiffener member, wherein the device is coupled to a printed circuit board.
A method of forming a device, comprising:
- forming a stiffener member;
- forming a plurality of vias extending from or through the stiffener member;
- forming a first step section and a second step section on the stiffener member, wherein the device is coupled to a printed circuit board.
A computing device comprising:
- a printed circuit board;
- and
- a device coupled to the printed circuit board comprising:
- a stiffener member comprising a first step section and a second step section;
- and
- a plurality of vias extending from or through the stiffener member.
3 more elements
Dependencies are inferred from the claim text.