Component Carrier Structure Connectable by Electrically Conductive Connection Medium in Recess With Cavity Having Surface Profile
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorAbderrazzaq Ifis
Life of this patent
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Abstract
A component carrier with a first component carrier structure including a first stack which has at least one first electrically conductive layer structure and at least one first electrically insulating layer structure is disclosed. The at least one first electrically conductive layer structure has a first contact element which extends up to a first contact surface of the first stack. An electrically conductive connection medium is directly connected to the first contact element at the first contact surface by filling at least one recess of the first contact element. The at least one recess having a larger dimensioned cavity delimited by a smaller dimensioned surface profile.
Claims20
A component carrier, comprising:
- a first component carrier structure comprising a first stack which comprises at least one first electrically conductive layer structure and at least one first electrically insulating layer structure, wherein the at least one first electrically conductive layer structure has a first contact element which extends up to a first contact surface of the first stack;
- and
- an electrically conductive connection medium directly connected to the first contact element at the first contact surface by filling at least one recess of the first contact element, the at least one recess comprising a larger dimensioned cavity delimited by a smaller dimensioned surface profile.
A method of manufacturing a component carrier, the method comprising:
- forming a first component carrier structure comprising a first stack which comprises at least one first electrically conductive layer structure and at least one first electrically insulating layer structure, wherein the at least one first electrically conductive layer structure has a first contact element which extends up to a first contact surface of the first stack;
- and
- directly connecting the first contact element at the first contact surface to an electrically conductive connection medium by filling at least one recess of the first contact element with the electrically conductive connection medium, the at least one recess comprising a larger dimensioned cavity delimited by a smaller dimensioned surface profile.
Dependencies are inferred from the claim text.