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US 2022/0068836 A1Published application
Embedded reference layers for semiconductor package substrates
AssigneeIntel Corporation
InventorsBok Eng Cheah, Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong, Kooi Chi Ooi
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Abstract
Two conductive reference layers are embedded in a semiconductor package substrate. The embedded reference layers facilitate low electromagnetic noise coupling between adjacent signals for semiconductor device package.
Claims16
A semiconductor package substrate, comprising:
- a core, wherein the core includes a conductor layer;
- a number of dielectric layers and conductive layers on a top and bottom of the core;
- a first via passing through the core from the top of the core to the bottom of the core, wherein the first via is electrically insulated from the conductor layer;
- and
- a second via passing through the core from the top of the core to the bottom of the core, wherein the second via is electrically coupled to the conductor layer.
2 more elements
A semiconductor device, comprising:
- a semiconductor die coupled to a semiconductor package substrate, the semiconductor package substrate including;
- a core, wherein the core includes a conductor layer;
- a number of dielectric layers and conductive layers on a top and bottom of the core;
- a first via passing through the core from the top of the core to the bottom of the core, wherein the first via is electrically insulated from the conductor layer;
- and
- a second via passing through the core from the top of the core to the bottom of the core, wherein the second via is electrically coupled to the conductor layer.
3 more elements
Dependencies are inferred from the claim text.