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US 2022/0068834 A1Published application
Wrappable emi shields
AssigneeIntel Corporation
InventorsEng Huat GOH, Tin Poay CHUAH, Yew San LIM, Min Suet LIM
Life of this patent
Estimating the term…
Abstract
According to the various aspects, the present device includes a printed circuit board having a top surface and a bottom surface, with a plurality of semiconductor devices coupled to the top surface and a flexible electromagnetic shield wrap conformally positioned over and between the plurality of semiconductor devices and the top surface of the printed circuit board. The flexible electromagnetic shield wrap is conformally positioned by applying a vacuum and is removable after the vacuum seal is broken.
Claims20
A device comprising:
- a printed circuit board comprising a top surface and a bottom surface;
- a plurality of semiconductor devices coupled to the top surface of the printed circuit board;
- and
- a flexible electromagnetic shield wrap conformally positioned over and between the plurality of semiconductor devices and on the top surface of the printed circuit board.
1 more element
A computing device comprising:
- a printed circuit board comprising a top surface and a bottom surface;
- a plurality of semiconductor devices coupled to the top surface of the printed circuit board;
- and
- a flexible electromagnetic shield wrap conformally positioned over and between the plurality of semiconductor devices and on the top surface of the printed circuit board.
1 more element
A method comprising:
- providing a printed circuit board comprising a top surface and a bottom surface for a device;
- coupling a plurality of semiconductor devices to the top surface of the printed circuit board;
- positioning a flexible electromagnetic shield wrap over the plurality of semiconductor devices on the printed circuit board;
- applying a vacuum to remove air between the flexible electromagnetic shield wrap and the plurality of semiconductor devices on the printed circuit board to conformally adhere the flexible electromagnetic shield wrap onto and between the plurality of semiconductor devices and onto the top and bottom surfaces of the printed circuit board.
1 more element
Dependencies are inferred from the claim text.