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US 2022/0068833 A1Published application
Electrical shield for stacked heterogeneous device integration
AssigneeIntel Corporation
InventorsSeok Ling LIM, Bok Eng CHEAH, Jenny Shio Yin ONG, Jackson Chung Peng KONG, Kooi Chi OOI
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Abstract
The present disclosure relates to a semiconductor package that may include a substrate, an interposer coupled to the substrate, a shield frame including at least one frame recess and at least one opening positioned over the interposer, a conductive shield layer on the shield frame, and a plurality of components coupled to the interposer.
Claims20
A semiconductor package comprising:
- a substrate;
- an interposer coupled to the substrate;
- a shield frame comprising at least one frame recess and at least one opening positioned over the interposer;
- a conductive shield layer on the shield frame;
- and
- a plurality of components coupled to the interposer.
3 more elements
A computing device comprising:
- a circuit board;
- and
- a semiconductor package coupled to the circuit board, the semiconductor package comprising:
- a substrate;
- an interposer coupled to the substrate;
- a shield frame comprising at least one frame recess and at least one opening positioned over the interposer;
- a conductive shield layer on the shield frame;
- and
- a plurality of components coupled to the interposer.
6 more elements
A method comprising:
- forming a shield frame comprising at least one frame recess and at least one opening;
- forming a conductive shield layer on the shield frame;
- providing a substrate;
- coupling an interposer to the substrate;
- coupling a plurality of active components to the interposer;
- and
- positioning the shield frame over the interposer to align the at least one frame recess and the at least one opening with the coupled plurality of components.
4 more elements
Dependencies are inferred from the claim text.