Connector for implementing multi-faceted interconnection and manufacturing method thereof

A method of manufacturing a connector for implementing multi-faceted interconnection, comprising the following steps:

• a) preparing a temporary bearing plate coated with copper on either side;
• b) forming a first copper pillar layer and a sacrificial copper pillar layer on the surface of the temporary bearing plate;
• c) applying an etch stop layer on the side face of the sacrificial copper pillar layer and electroplating to form a second copper pillar layer;
• d) laminating insulating materials to form a first dielectric layer;
• e) forming a first circuit layer on the first dielectric layer;
• f) extending a second copper pillar layer and a sacrificial copper pillar layer on the first circuit layer along a height direction, and forming a sacrificial copper layer on the first circuit layer;
• g) laminating an insulating material on the first circuit layer to form a second dielectric layer;
• h) removing a temporary bearing plate;
• i) simultaneously forming a second circuit layer and a third circuit layer on the first dielectric layer and the second dielectric layer;
• j) etching the sacrificial copper layer and the sacrificial copper pillar layer away.