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US 2022/0068801 A1Published application
Electronic package, manufacturing method for the same, and electronic structure
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsFeng Kao, Lung-Yuan Wang
Life of this patent
Estimating the term…
Abstract
An electronic package is provided, in which an electronic structure used as an integrated voltage regulator and a plurality of conductive pillars are embedded in an encapsulating layer to facilitate electrical transmission with electronic components at a close range.
Claims20
An electronic structure, comprising:
- an electronic body including a first side and a second side opposite to each other, wherein the electronic body includes a base and a circuit portion formed on the base, such that the base defines the second side, and the circuit portion defines the first side, and the base includes a plurality of conductive vias electrically connected with the circuit portion and exposed from the second side;
- a plurality of first conductors formed on the first side of the electronic body and electrically connected with the circuit portion;
- a plurality of second conductors formed on the second side of the electronic body and electrically connected with the conductive vias;
- a first insulating layer formed on the first side of the electronic body and encapsulating the first conductors;
- and
- a second insulating layer formed on the second side of the electronic body and encapsulating the second conductors.
3 more elements
A method for manufacturing an electronic package, comprising:
- providing an electronic body including a first side and a second side opposite to each other, wherein the electronic body includes a base and a circuit portion formed on the base, such that the base defines the second side, and the circuit portion defines the first side, and the base includes a plurality of conductive vias electrically connected with the circuit portion and exposed from the second side;
- forming a plurality of first conductors and a plurality of second conductors on the first side and the second side of the electronic body, respectively, thereby electrically connecting the first conductors with the circuit portion and electrically connecting the second conductors with the conductive vias;
- forming a first insulating layer and a second insulating layer on the first side and the second side of the electronic body, respectively, thereby encapsulating the first conductors and the second conductors by the first insulating layer and the second insulating layer, respectively, to form an electronic structure;
- disposing the electronic structure on a carrier board via the first insulating layer, with a plurality of conductive pillars being formed on the carrier board;
- forming an encapsulating layer on the carrier board for encapsulating the electronic structure and the conductive pillars, wherein the encapsulating layer includes a first surface and a second surface opposite to each other, and the encapsulating layer is bonded to the carrier board via the first surface;
- and
- removing the carrier board.
4 more elements
Dependencies are inferred from the claim text.