Package and substrate comprising interconnects with semi-circular planar shape and/or trapezoid planar shape

A substrate comprising:

• at least one dielectric layer;
• a plurality of first interconnects located in the at least one dielectric layer;
• at least one photo-imageable dielectric layer coupled to the at least one dielectric layer;
• and
• a plurality of second interconnects located in the at least one photo-imageable dielectric layer, wherein the plurality of second interconnects comprises at least one via interconnect having a semi-circular planar shape.

An apparatus comprising:

• an integrated device;
• a substrate coupled to the integrated device, the substrate comprising:
• at least one dielectric layer;
• a plurality of first interconnects located in the at least one dielectric layer;
• at least one photo-imageable dielectric layer coupled to the at least one dielectric layer;
• and
• a plurality of second interconnects located in the at least one photo-imageable dielectric layer, the plurality of second interconnects comprising at least one pair of adjacent via interconnects having a centroid to centroid distance that is less than a pitch between the pair of adjacent via interconnects.

A method for fabricating substrate, comprising:

• forming at least one dielectric layer;
• forming a plurality of first interconnects in the at least one dielectric layer;
• forming at least one photo-imageable dielectric layer over the at least one dielectric layer;
• and
• forming a plurality of second interconnects in the at least one photo-imageable dielectric layer, wherein forming the plurality of second interconnects comprises forming at least one pair of adjacent interconnects having a centroid to centroid distance that is less than a pitch between the pair of adjacent interconnects.