Structures With Deformable Conductors
AssigneeLiquid Wire Inc.
InventorsMark William Ronay, Trevor Antonio Rivera, Michael Adventure Hopkins, Edward Martin Godshalk, Charles J. Kinzel
Life of this patent
Estimating the term…
Abstract
A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.
Claims21
(canceled)
A circuit assembly comprising:
- a substrate layer;
- a patterned layer, positioned on the substrate layer, forming a channel and a plurality of contact points;
- conductive gel, positioned within the channel and the plurality of contact points;
- an encapsulant layer, positioned on the patterned layer and encapsulating the conductive gel within the channel;
- and
- an electric component supported by the substrate layer and having terminals operatively coupled to the plurality of contact points.
A method of making a circuit assembly comprising:
- positioning a patterned layer on a substrate layer, the patterned layer forming a channel and a plurality of contact points;
- positioning conductive gel within the channel and the plurality of contact points;
- positioning an encapsulant layer on the patterned layer and encapsulating the conductive gel within the channel;
- and
- supporting an electric component by the substrate layer and having terminals operatively coupled to the plurality of contact points.
Dependencies are inferred from the claim text.