Fan-out type semiconductor package

A fan-out type semiconductor package comprising:

• a frame including a cavity and a middle redistribution layer (RDL) structure configured to at least partially surround the cavity;
• a semiconductor chip arranged in the cavity;
• a lower RDL structure arranged on the frame and electrically connected with the semiconductor chip and the middle RDL structure;
• an upper RDL structure arranged on the frame and electrically connected with the middle RDL structure;
• a first shielding pattern arranged in the upper RDL structure to shield a first portion of the semiconductor chip from an electromagnetic interference (EMI);
• a second shielding pattern arranged in the lower RDL structure to shield a second portion of the semiconductor chip from the EMI;
• and
• a third shielding pattern arranged in the middle RDL structure to shield a third portion of the semiconductor chip from the EMI.

A fan-out type semiconductor package comprising:

• a frame including a cavity and a middle redistribution layer (RDL) structure configured to at least partially surround the cavity;
• a semiconductor chip arranged in the cavity;
• a lower RDL structure arranged on the frame and electrically connected with the semiconductor chip and the middle RDL structure;
• an upper RDL structure arranged on the frame and electrically connected with the middle RDL structure;
• and
• a shielding pattern configured to cover at least one surface of the semiconductor chip to shield the semiconductor chip from an electromagnetic interference (EMI).