Substrate structures and methods for forming the same and semiconductor package structures
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorWen Hung HUANG
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Abstract
A substrate structure and a method for manufacturing the same are provided. The substrate structure includes a first conductive layer, a dielectric layer, a second conductive layer and a connection layer. The dielectric layer is disposed on the first conductive layer. The dielectric layer defines an opening exposing the first conductive layer. The second conductive layer is disposed on the dielectric layer. The connection layer extends from an upper surface of the first conductive layer to a lateral surface of the second conductive layer. A surface roughness of an upper surface of the second conductive layer ranges from about 0.5 μm to about 1.25 μm.
Claims21
A substrate structure, comprising:
- a first conductive layer;
- a dielectric layer disposed on the first conductive layer, the dielectric layer defining an opening exposing the first conductive layer;
- a second conductive layer disposed on the dielectric layer;
- and
- a connection layer extending from an upper surface of the first conductive layer to a lateral surface of the second conductive layer,
- wherein a surface roughness of an upper surface of the second conductive layer ranges from about 0.5 μm to about 1.25 μm.
10-20. (canceled)
Dependencies are inferred from the claim text.