Wiring structure and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorWen-Long LU
Life of this patent
Estimating the term…
Abstract
A wiring structure and a method for manufacturing the same are provided. The wiring structure includes a conductive structure and a plurality of conductive through vias. The conductive structure includes a dielectric layer, a circuit layer in contact with the dielectric layer, a plurality of dam portions and an outer metal layer. The dam portions extend through the dielectric layer. The dam portion defines a through hole. The outer metal layer is disposed adjacent to a top surface of the dielectric layer and extends into the through hole of the dam portion. The conductive through vias are disposed in the through holes of the dam portions and electrically connecting the circuit layer.
Claims20
A wiring structure comprising:
- a conductive structure including a dielectric layer, a circuit layer in contact with the dielectric layer, a plurality of dam portions and an outer metal layer, wherein the dam portions extend through the dielectric layer, the dam portion defines a through hole, and the outer metal layer is disposed adjacent to a top surface of the dielectric layer and extends into the through hole of the dam portion;
- and
- a plurality of conductive through vias disposed in the through holes of the dam portions and electrically connecting the circuit layer.
A wiring structure, comprising:
- a lower element;
- an upper conductive structure attached to the lower element through a bonding layer, wherein the upper conductive structure includes a dielectric layer, a circuit layer in contact with the dielectric layer, a plurality of dam portions and an outer metal layer, wherein the dam portions extend through the dielectric layer, each of the dam portions defines a through hole, the outer metal layer is disposed adjacent to a top surface of the dielectric layer and extends into the through hole of the dam portion;
- and
- a plurality of conductive through vias disposed in the through holes of the dam portions, and electrically connecting the lower element and the circuit layer of the upper conductive structure.
A method for manufacturing a wiring structure, comprising:
- (a) providing an upper conductive structure, wherein the upper conductive structure includes a dielectric layer, a circuit layer in contact with the dielectric layer, and a plurality of dam portions, wherein the dam portions extend through the dielectric layer, each of the dam portions defines a central hole;
- (b) attaching the upper conductive structure to a lower element through a bonding layer;
- (c) removing a portion of the dam portion corresponding to the central hole to form a through hole;
- (d) forming an outer metal layer adjacent to a top surface of the dielectric layer, wherein the outer metal layer extends into the through hole of the dam portion to cover at least a portion of the dam portion;
- and
- (e) forming a conductive through via to extend through the upper conductive structure and the bonding layer, and contact the lower element.
Dependencies are inferred from the claim text.