Apparatuses and systems having ball grid arrays and associated microelectronic devices and device packages

An apparatus, comprising:

• a first memory device, comprising:
• a device substrate comprising a semiconductor material and bond pads coupled with an active surface of the device substrate;
• a package substrate secured to the device substrate, the package substrate configured to route signals to and from the bond pads;
• and
• a ball grid array supported on, and electrically connected to, the package substrate;
• a second memory device;
• and
• a printed circuit board interposed between, and secured to, each of the first memory device and the second memory device;
• wherein each ball of the ball grid array of the first memory device positioned and configured to carry a clock signal or a strobe signal is located in a central column of the ball grid array.

A system, comprising:

• a central processing unit (CPU);
• and
• at least one memory device connected to the CPU, the at least one memory device comprising:
• a device substrate comprising a semiconductor material and bond pads coupled with an active surface of the device substrate;
• a package substrate secured to the device substrate, the package substrate configured to route signals to and from the bond pads;
• and
• a ball grid array supported on, and electrically connected to, the package substrate;
• wherein each ball of the ball grid array positioned and configured to carry a clock signal or a strobe signal is located in a central column of the ball grid array.

An apparatus, comprising:

• a first memory device, comprising:
• a device substrate comprising a semiconductor material and bond pads coupled with an active surface of the device substrate;
• a package substrate secured to the device substrate, the device substrate secured to the package substrate by a direct chip attach, the package substrate configured to route signals to and from the bond pads;
• and
• a first ball grid array supported on, and electrically connected to, the package substrate;
• a second memory device comprising a second ball grid array;
• and
• a printed circuit board interposed between, and secured to, each of the first ball grid array of the first memory device and the second ball grid array of the second memory device, the second ball grid array of the second memory device being rotationally symmetrical across the printed circuit board relative to the first ball grid array of the first memory device;
• wherein each ball of the ball grid array of the first memory device positioned and configured to carry a clock signal or a strobe signal is located in a central column of the ball grid array.