Lead frame-based semiconductor package

A method of producing a semiconductor package, the method comprising:

• providing a lead frame comprising a common base and a plurality of blocks of uniform size and laterally spaced apart from one another with uniform spacing, the blocks extending from the common base in a direction perpendicular to the lateral spacing between the blocks;
• attaching a first semiconductor die to a first group of the blocks;
• connecting a plurality of input/output (I/O) terminals of the first semiconductor die to a second group of the blocks, at least some blocks of the second group being laterally spaced outward from the first group of blocks;
• encapsulating the first semiconductor die and the connections between the I/O terminals and the second group of blocks in a mold compound;
• and
• after the encapsulating, removing the common base of the lead frame or severing the common base at least between the blocks of the second group that are connected to different electric potentials or to different signals.