Power electronic switching device with a three-dimensionally preformed insulation molding and a method for its manufacture
AssigneeSemikron Elektronik GmbH & Co. KG
InventorMICHAEL SCHATZ
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Abstract
A power electronic switching device has a substrate facing in a normal direction with a first and a second conductive track, and a power semiconductor component is arranged on the first conductive track by an electrically conductive connection. The power semiconductor component has a laterally surrounding edge and an edge region and a contact region on its first primary side facing away from the substrate, and with a three-dimensionally preformed insulation molding that has an overlap segment, a connection segment and an extension segment, wherein the overlap segment, starting from the edge partially overlaps the edge region of the power semiconductor component.
Claims16
A power electronic switching device (1), comprising:
- a substrate (2) facing in a normal direction (N) with a first and a second conductive track (22, 24);
- a power semiconductor component (5) arranged on the first conductive track (22) by means of an electrically conductive connection (900);
- the power semiconductor component (5) further comprising:
- a laterally surrounding edge (50) and an edge region (52) and a contact region (54) on its first primary side (500) facing away from the substrate (2);
- a three-dimensionally preformed insulation molding (4) includes an overlap segment (42), a connection segment (44) and an extension segment (46);
- the overlap segment (42) as seen from the normal direction (N) and starting from the edge (50) partially overlaps the edge region (52) of the power semiconductor component (5).
Dependencies are inferred from the claim text.