Semiconductor device and semiconductor device with cooling member
AssigneeMitsubishi Electric Corporation
InventorTakahiko MURAKAMI
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AssigneeMitsubishi Electric Corporation
InventorTakahiko MURAKAMI
Estimating the term…
A semiconductor device includes a base plate, a case, and a collar. The base plate includes a metal or an alloy. The base plate has a first bolt hole. The case includes a resin. The case has a first main surface and a second main surface. The second main surface is in contact with the base plate. The case has a through-hole. The collar includes a metal or an alloy. The collar is located within the through-hole. The collar has a first end and a second end. The first end is located on a side where the first main surface is located. The second end is located on a side where the second main surface is located. The collar has a second bolt hole. The first end has a flange. Alternatively, the collar has an outer circumferential surface. The outer circumferential surface has a straight knurling.
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.