Direct write, high conductivity mmic attach
AssigneeNorthrop Grumman Systems Corporation
InventorsJesse Tice, Steven J. Mass, Michael T. Barako
Life of this patent
Estimating the term…
Abstract
An integrated circuit assembly including an integrated circuit formed on one side of a substrate and a thermal spreading layer composed of a silver ink directly printed on an opposite side of the substrate from the integrated circuit, where the thermal spreading layer removes heat generated by the integrated circuit. The assembly also includes a heat sink thermally attached to the thermal spreading layer opposite to the substrate, where the heat sink is attached to the thermal spreading layer by printing the same material on the heat sink as the thermal spreading layer and pressing the spreading layer to the heat sink.
Claims20
An integrated circuit assembly comprising:
- a substrate;
- an integrated circuit formed on one side of the substrate;
- a thermal spreading layer printed on an opposite side of the substrate from the integrated circuit, wherein the thermal spreading layer removes heat generated by the integrated circuit;
- and
- a heat sink thermally attached to the thermal spreading layer opposite to the substrate, wherein the heat sink is part of a hermetically sealed housing for the integrated circuit.
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An integrated circuit assembly comprising:
- a substrate;
- a monolithic microwave integrated circuit (MMIC) formed on one side of the substrate;
- a thermal spreading layer composed of a silver ink directly printed on an opposite side of the substrate from the MMIC, wherein the thermal spreading layer removes heat generated by the MMIC;
- and
- a heat sink thermally attached to the thermal spreading layer opposite to the substrate, wherein the heat sink is attached to the thermal spreading layer by printing the same material on the heat sink as the thermal spreading layer and pressing the spreading layer to the heat sink.
A method for providing an integrated circuit assembly, said method comprising:
- providing a substrate;
- forming an integrated circuit formed on one side of the substrate;
- printing a thermal spreading layer on an opposite side of the substrate from the integrated circuit, wherein the thermal spreading layer removes heat generated by the integrated circuit;
- and
- thermally attaching a heat sink to the thermal spreading layer opposite to the substrate, wherein attaching the heat sink to the thermal spreading layer includes printing the same material on the heat sink as the thermal spreading layer and pressing the spreading layer to the heat sink.
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Dependencies are inferred from the claim text.