Back to results
US 2022/0068703 A1Published application
Metal interconnect wrap around with graphene
AssigneeQUALCOMM Incorporated
InventorsJunjing BAO, John Jianhong ZHU, Periannan CHIDAMBARAM
Life of this patent
Estimating the term…
Abstract
Disclosed are examples of interconnect structures, e.g., in semiconductor packages. The interconnect structures may include metal lines with graphene. Graphene aids in reducing resistivity of metals used in interconnects. Graphene also serves as diffusion barriers. These properties are advantages when critical dimensions of conductive structures are reduced.
Claims30
An interconnect structure, comprising:
- a lower line formed in a dielectric;
- and
- an upper line formed on or above the lower line, the upper line being electrically coupled with the lower line, the upper line comprising:
- an upper metal formed on or above the lower line;
- and
- an upper graphene formed on at least a portion of an upper surface of the upper metal, at least a portion of a first side surface of the upper metal, and/or at least a portion of a second side surface of the upper metal.
3 more elements
A method of fabricating an interconnect structure, the method comprising:
- forming a lower line in a dielectric;
- and
- forming an upper line on or above the lower line, the upper line being electrically coupled with the lower line, the upper line comprising:
- an upper metal formed on or above the lower line;
- and
- an upper graphene formed on at least a portion of an upper surface of the upper metal, at least a portion of a first side surface of the upper metal, and/or at least a portion of a second side surface of the upper metal.
3 more elements
Dependencies are inferred from the claim text.