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US 2022/0068699 A1Published application
Wafer processing apparatus and wafer processing method
AssigneeZeus Co., Ltd.
InventorsWoon KONG, Ji Hoon SONG, Ung Jo MOON, Ji Ho PARK, Won Seok CHOI
Life of this patent
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Abstract
A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a chuck module installed in the rotating chuck to fix the ring cover to the rotating chuck.
Claims20
A wafer processing apparatus comprising:
- a rotating chuck rotatably installed on a driver;
- a vacuum chuck which is disposed on a rotating chuck and on which a wafer is seated;
- a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck;
- and
- a chuck module installed in the rotating chuck to fix the ring cover to the rotating chuck.
2 more elements
A wafer processing method comprising:
- mounting a wafer on a vacuum chuck;
- arranging a ring cover on a circumferential portion of the vacuum chuck;
- fixing the wafer to the vacuum chuck and fixing the ring cover to a rotating chuck as a chuck module is moved;
- and
- rotating the rotating chuck and the vacuum chuck and spraying a supply solution onto the wafer to etch the wafer.
2 more elements
Dependencies are inferred from the claim text.