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US 2022/0068690 A1Published application
Substrate transfer devices
OwnerSreenath SOVENAHALLI, Kirankumar Neelasandra SAVANDAIAH +3inventors
InventorsSreenath SOVENAHALLI, Kirankumar Neelasandra SAVANDAIAH, Lakshmikanth Krishnamurthy SHIRAHATTI, Srinivasa Rao YEDLA, Thomas BREZOCZKY
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Abstract
A method and apparatus for processing substrates is described herein. In one embodiment, a transfer apparatus is described that includes a blade, a plurality of support arms coupled to the blade, a plurality of grippers coupled to each of the support arms, and a grip actuator operably coupled to the support arms or one or more of the plurality of grippers.
Claims20
A transfer apparatus, comprising:
- a blade;
- a plurality of support arms coupled to the blade;
- a plurality of grippers coupled to each of the support arms;
- and
- a grip actuator operably coupled to the support arms or one or more of the plurality of grippers.
2 more elements
A transfer apparatus, comprising:
- a blade;
- a plurality of support arms coupled to the blade;
- a plurality of movable grippers coupled to each of the support arms;
- and
- a grip actuator operably coupled to one or more of the plurality of grippers.
2 more elements
A transfer apparatus, comprising:
- a blade;
- a gripper coupled to the blade, the gripper having an upper surface and a lower surface;
- a plurality of electrodes coupled to the gripper, wherein the gripper is configured to electrostatically hold a substrate from the lower surface via the plurality of electrodes.
Dependencies are inferred from the claim text.