Semiconductor substrate alignment device and a semiconductor substrate bonding system using the same

A semiconductor substrate alignment device comprising:

• a first chuck configured to receive a first semiconductor substrate having a first alignment key;
• a first driving unit configured to adjust an alignment position of the first semiconductor substrate;
• a second chuck configured to receive a second semiconductor substrate opposing the first semiconductor substrate and having a second alignment key;
• a plurality of observation windows in a region of the second chuck overlapping that of the second semiconductor substrate;
• a plurality of imaging units respectively configured to irradiate transmitted light through the plurality of observation windows and to obtain images by detecting measured light reflected from the first and second semiconductor substrates;
• a distance sensor configured to detect a distance between an edge of the first chuck and an edge of the second chuck;
• and
• a control unit configured to identify the first and second alignment keys from the images of the first and second semiconductor substrates, calculate an alignment error value of the first and second semiconductor substrates, and compensate for the alignment error value by driving the first driving unit.

A semiconductor substrate bonding system comprising:

• a first chuck configured to receive a first semiconductor substrate having a first alignment key;
• a first driving unit configured to adjust an alignment position of the first semiconductor substrate;
• a second chuck configured to receive a second semiconductor substrate opposing the first semiconductor substrate and having a second alignment key;
• a plurality of observation windows in a region of the second chuck overlapping that of the second semiconductor substrate;
• a plurality of imaging units configured to irradiate transmitted light through the plurality of observation windows and to obtain images by detecting measured light reflected from the first and second semiconductor substrates;
• a distance sensor configured to detect a distance between an edge of the first chuck and an edge of the second chuck;
• first and second pressing units respectively at centers of the first and second chucks, and respectively configured to press the centers of the first and second semiconductor substrates such that the first and second semiconductor substrates are brought into contact with each other and spontaneous bonding propagates between the first and second semiconductor substrates;
• and
• a control unit configured to identify the first and second alignment keys from the images of the first and second semiconductor substrates, calculate an alignment error value of the first and second semiconductor substrates, compensate for the alignment error value by driving the first driving unit, and instigate the bonding of the first and second semiconductor substrates to each other.