Substrate treatment apparatus and manufacturing method of semiconductor device
AssigneeKioxia Corporation
InventorsSatoshi NAKAOKA, Yuji HASHIMOTO, Hiroshi FUJITA
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Abstract
A substrate treatment apparatus according to an embodiment includes: a tank configured to store a liquid chemical with which a plurality of substrates are treated; a piping having an ejection port that ejects the liquid chemical or bubbles into the tank; a plurality of rods that support the plurality of substrates in the tank; and a converter that is provided in the plurality of rods or the tank and that converts vibration applied to each substrate by the liquid chemical or the bubbles ejected from the piping into rotation in one direction around a center of the substrate as a rotational axis.
Claims16
A substrate treatment apparatus comprising:
- a tank configured to store a liquid chemical with which a plurality of substrates are treated;
- a piping having an ejection port that ejects the liquid chemical or bubbles into the tank;
- a plurality of rods that support the plurality of substrates in the tank;
- and
- a converter that is provided in the plurality of rods or the tank and that converts vibration applied to each substrate by the liquid chemical or the bubbles ejected from the piping into rotation in one direction around a center of the substrate as a rotational axis.
A manufacturing method of a semiconductor device, comprising:
- immersing a plurality of substrates in a liquid chemical stored in a tank;
- ejecting the liquid chemical or bubbles into the tank;
- and
- etching a film formed on the substrate while converting vibration applied to each substrate by the ejected liquid chemical or bubbles into rotation in one direction around a center of the substrate as a rotational axis.
Dependencies are inferred from the claim text.