Substrate processing apparatus and substrate processing method
AssigneeShibaura Mechatronics Corporation
InventorsKensuke DEMURA, Daisuke MATSUSHIMA, Masaya KAMIYA
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AssigneeShibaura Mechatronics Corporation
InventorsKensuke DEMURA, Daisuke MATSUSHIMA, Masaya KAMIYA
Estimating the term…
A substrate processing apparatus according to an embodiment of the present disclosure includes: a stage; a plurality of holders configured to hold a substrate; a liquid supply configured to supply a liquid to a surface of the substrate opposite to the stage; a cooler configured to supply a cooling gas to a space between the stage and the substrate; a mover configured to change a distance between the stage and the substrate; and a controller configured to control the cooler and the mover. The controller performs a cooling process that at least includes a supercooling process and a freezing process (solid-liquid phase), and a thawing process after the cooling process. In the cooling process, the controller controls the mover to set the distance to a first distance, and in the thawing process, the controller controls the mover to set the distance to a second distance longer than the first distance.
A substrate processing apparatus comprising:
A substrate processing apparatus comprising:
A substrate processing method comprising:
Dependencies are inferred from the claim text.