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US 2022/0068670 A1Published application
Substrate processing method and substrate processing apparatus
AssigneeTokyo Electron Limited
InventorAkiko KAI
Life of this patent
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Abstract
A substrate processing method includes supplying a processing liquid to a peripheral edge of a surface of a substrate to form a processing film on the peripheral edge of the surface of the substrate; and bringing a molding solvent supplied to an inner region than a region of the surface of the substrate to which the processing liquid is supplied, into contact with an interface of the processing liquid that faces a central side of the surface.
Claims16
A substrate processing method comprising:
- supplying a processing liquid to a peripheral edge of a surface of a substrate to form a processing film on the peripheral edge of the surface of the substrate;
- and
- bringing a molding solvent supplied to an inner region than a region of the surface of the substrate to which the processing liquid is supplied, into contact with an interface of the processing liquid that faces a central side of the surface.
A substrate processing apparatus comprising:
- a substrate holder configured to rotatably hold a substrate;
- a processing liquid supply configured to supply a processing liquid to a surface of the substrate;
- a solvent supply configured to supply a molding solvent to a surface of the substrate;
- and
- a controller configured to control the substrate holder, the processing liquid supply, and the solvent supply to perform a process including:
- supplying a processing liquid to a peripheral edge of a surface of a substrate to form a processing film on the peripheral edge of the surface of the substrate;
- and
- bringing a molding solvent supplied to an inner region than a region of the surface of the substrate to which the processing liquid is supplied, into contact with an interface of the processing liquid that faces a central side of the surface.
5 more elements
Dependencies are inferred from the claim text.