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US 2022/0068665 A1Published application
Semiconductor device package and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsJenchun CHEN, An-Ping CHIEN
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Abstract
The present disclosure relates to a method of manufacturing a semiconductor device package. The method includes: (a) disposing a support structure on a first substrate; (b) electrically connecting a first electronic component on the first substrate, wherein a portion of the first electronic component is separated from the first substrate by the support structure; (c) heating the semiconductor device package; and (d) removing the support structure.
Claims20
A method of manufacturing a semiconductor device package, comprising:
- (a) disposing a support structure on a first substrate;
- (b) electrically connecting a first electronic component on the first substrate, wherein a portion of the first electronic component is separated from the first substrate by the support structure;
- (c) heating the semiconductor device package;
- and
- (d) removing the support structure.
2 more elements
A method of manufacturing a semiconductor device package, comprising:
- (a) disposing a plurality of substrates on a carrier, the substrates spaced apart from each other;
- (b) disposing a plurality of support structures on the substrates, each of the support structures disposed on two adjacent substrates and partially extending within a gap defined by two adjacent substrates;
- and
- (c) electrically connecting a plurality of electronic components on the substrates respectively, wherein each of the electronic components covers a portion of the support structure.
1 more element
Dependencies are inferred from the claim text.