Apparatus and method for planarizing a substrate

A method of planarizing a substrate, the method comprising:

• determining injection conditions including a set temperature and a set pressure of a gas applied to the substrate;
• preparing the substrate on which a coating layer is formed before a hardening process;
• and
• injecting the gas having the set temperature and the set pressure to the coating layer on the substrate.

An apparatus comprising:

• a supporting plate for receiving a semiconductor substrate, the supporting plate being capable of rotating, and vibrating to impart the rotating and vibrating to the substrate for planarizing a coating layer disposed on the substrate;
• and
• an injection mechanism comprising a plurality of nozzles,
• wherein the injection mechanism injects a first gas having a first temperature through at least one of the plurality of the nozzles on a first surface of the coating layer, and a second gas having a second temperature through at least another one of the plurality of nozzles on a second surface of the coating layer.