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US 2022/0068631 A1Published application
Semiconductor substrate, semiconductor device, and method for forming semiconductor structure
AssigneeVanguard International Semiconductor Corporation
InventorChih-Yen CHEN
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Abstract
A semiconductor substrate is provided. The semiconductor substrate includes a ceramic base, a seed layer, and a nucleation layer. The ceramic base has a front surface and a back surface, and the front surface is a non-flat surface. The seed layer is disposed on the front surface of the ceramic substrate. The nucleation layer is disposed on the seed layer.
Claims20
A semiconductor substrate, comprising:
- a ceramic base having a front surface and a back surface, and the front surface is a non-flat surface;
- a seed layer disposed on the front surface of the ceramic base;
- and
- a nucleation layer disposed on the seed layer.
1 more element
A method for forming a semiconductor structure, comprising:
- providing a ceramic base having a front surface and a back surface, and the front surface is a non-flat surface;
- forming a seed layer on the front surface of the ceramic base;
- and
- forming a nucleation layer on the seed layer.
1 more element
Dependencies are inferred from the claim text.