Back to results
US 2022/0068615 A1Published application
Stage and plasma processing apparatus
AssigneeTokyo Electron Limited
InventorShinsuke OKA
Life of this patent
Estimating the term…
Abstract
A stage includes a first placement table on which a substrate is placed, and a second placement table configured to place thereon a ring-shaped edge ring arranged around the substrate. The second placement table includes an electrostatic clamping electrode configured to clamp the edge ring by being applied with a voltage, and a temperature adjuster provided on at least one of an inner peripheral side and an outer peripheral side of the edge ring with respect to the electrostatic clamping electrode.
Claims15
A stage comprising:
- a first placement table on which a substrate is placed;
- and
- a second placement table configured to place thereon a ring-shaped edge ring arranged around the substrate,
- wherein the second placement table includes:
- an electrostatic clamping electrode configured to clamp the edge ring by being applied with a voltage;
- and
- a temperature adjuster provided on at least one of an inner peripheral side and an outer peripheral side of the edge ring with respect to the electrostatic clamping electrode.
4 more elements
Dependencies are inferred from the claim text.