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US 2022/0068614 A1Published application
Semiconductor manufacturing member and manufacturing method therefor
AssigneeCoorsTek, Inc.
InventorsMasahiko ICHISHIMA, Hiroshi OISHI, Noriko OMORI, Akira MIYAZAKI, Masahiro KUBOTA, Jun KOMIYAMA
Life of this patent
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Abstract
The present invention relates to a semiconductor manufacturing member including a silicon carbide-containing boron carbide film at least on a surface thereof, in which the silicon carbide-containing boron carbide film has a content of silicon carbide of 5 wt % or more and 18 wt % or less and a balance being boron carbide.
Claims6
A semiconductor manufacturing member comprising a silicon carbide-containing boron carbide film at least on a surface thereof,
- wherein the silicon carbide-containing boron carbide film has a content of silicon carbide of 5 wt % or more and 18 wt % or less and a balance being boron carbide.
A method of manufacturing a semiconductor manufacturing member comprising:
- preparing a raw material comprising silicon carbide and boron carbide;
- and
- thermally spraying the raw material onto a base material to form a thermal-sprayed film comprising boron carbide comprising 5 wt % or more and 18 wt % or less of silicon carbide.
Dependencies are inferred from the claim text.