Method for preparing a tem sample
AssigneeShanghai Huali Integrated Circuit Corporation
InventorsQiang CHEN, Yanrong QIU, Jinde GAO
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AssigneeShanghai Huali Integrated Circuit Corporation
InventorsQiang CHEN, Yanrong QIU, Jinde GAO
Estimating the term…
The present application discloses a method for preparing a TEM sample, including the following steps: step 1: providing a thin-film pre-sample with undesirable voids; step 2: performing a first cutting with a first FIB to form the TEM sample located in the target region of the thin-film pre-sample. The first thickness is reached after the first cutting. The voids are exposed from the front surface or the back surface of the TEM sample after the first cutting; step 3: depositing a first material layer by an ALD process to fill the voids in the TEM sample; step 4: performing the second cutting with a second FIB to form the target thickness of the TEM sample in the target region of the thin-film pre-sample. The present application can reduce or eliminate ion beam cutting marks related to the voids in the thin-film pre-sample.
A method for preparing a transmission electron microscope (TEM) sample, comprising a plurality of steps:
Dependencies are inferred from the claim text.