System and method for bare wafer inspection
AssigneeASML Netherlands B.V.
InventorsWei FANG, Joe WANG
Life of this patent
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Abstract
A wafer inspection system includes a controller in communication with an electron-beam inspection tool. The controller includes circuitry to: acquire, via an optical imaging tool, coordinates of defects on a sample; set a Field of View (FoV) of the electron-beam inspection tool to a first size to locate a subset of the defects; determine a position of each defect of the subset of the defects based on inspection data generated by the electron-beam inspection tool during a scanning of the sample; adjust the coordinates of the defects based on the determined positions of the subset of the defects; and set the FoV of the electron-beam inspection tool to a second size to locate additional defects based on the adjusted coordinates.
Claims21
1-15. (canceled)
A system comprising:
- an optical imaging tool including circuitry to illuminate a sample with light and detect light scattered from the sample;
- an inspection tool including circuitry to generate inspection data associated with the sample;
- and
- a controller in communication with the optical imaging tool and the inspection tool, the controller including circuitry to:
- receive light-scattering data generated by the optical imaging tool;
- determine coordinates of defects on the sample based on the light-scattering data;
- set a Field of View (FoV) of the inspection tool to a first size to locate a subset of the defects;
- determine a position of each defect of the subset of the defects based on inspection data generated by the inspection tool based on the sample;
- adjust the coordinates of the defects based on the determined positions of the subset of the defects;
- and
- set the FoV of the inspection tool to a second size to locate additional defects based on the adjusted coordinates.
A controller coupled with an inspection tool configured to generate inspection data associated with a sample, the controller comprising:
- a memory storing instructions;
- and
- a processor configured to execute the instructions to cause the controller to:
- acquire, via an optical imaging tool, coordinates of defects on the sample;
- set a Field of View (FoV) of the inspection tool to a first size to locate a subset of the defects;
- determine a position of each defect of the subset of the defects based on the inspection data generated by the inspection tool during a scan of the sample;
- adjust the coordinates of the defects based on the determined positions of the subset of the defects;
- and
- set the FoV of the electron-beam inspection tool to a second size to locate additional defects based on the adjusted coordinates.
A computer-implemented method comprising:
- acquiring, via an optical imaging tool, coordinates of defects on a sample;
- setting a Field of View (FoV) of an inspection tool to a first size to locate a subset of the defects;
- determining a position of each defect of the subset of the defects based on inspection data generated by the inspection tool during a scan of the sample;
- adjusting the coordinates of the defects based on the determined positions of the subset of the defects;
- and
- setting the FoV of the inspection tool to a second size to locate additional defects based on the adjusted coordinates.
Dependencies are inferred from the claim text.